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BDXXKA5-E Datasheet, PDF (9/18 Pages) Rohm – low-saturation regulators that are available for output currents up to 500mA. | |||
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BDxxKA5 Series BDxxKA5W Series BD00KA5W Series
Datasheet
âI/O equivalence circuit
Vcc
31.25kΩ 2kΩ
CTL
25kΩ
Vcc Vcc
Fig.18
Vcc
R2
R1
â» With BD00KA5WFP/WF,R1and R2 are connected
outside the IC between ADJ and GND and
OUT
between OUT and ADJ.
ADJ
(BD00KA5WFP/WF)
Fig.19
âPower Dissipation
2 .0
1 .6
1.30
1 .2
TO252-5
Rohm standard board mounting
Board sizeï¼70Ã70Ã1.6ï½ï½
Copper foil areaï¼7Ã7ï½ï½2
θja=96.2(â/W)
0 .8
0 .4
0 .0
0
25
50
75 100 125 150
Ambient temperatureï¼Ta(â)
Fig.20 Power Dissipation heat
reducing characteristics
2 .0
1 .6
1.20
1 .2
TO252-3
Rohm standard board mounting
Board sizeï¼70Ã70Ã1.6ï½ï½
Copper foil areaï¼7Ã7ï½ï½2
θja=104.2(â/W)
0 .8
0 .4
0 .0
0
25
50
75 100 125 150
Ambiå¨entå²tem温pe度ratuï¼reTï¼aT(aâ(â))
Fig.21 Power Dissipation heat
reducing characteristics
1000
800
687.6mW
600
562.6mW
400
200
SOP8
(1)When using a standard board:
θj-c=181.8(â/W)
(2) When using an IC alone
θj-a=222.2(â/W)
(1)
(2)
0
0
25
50
75 100 125 150
Ambient temperatureï¼Ta(â)
å¨å²æ¸©åº¦ï¼Ta(â)
Fig.22 Power Dissipation heat
reducing characteristics
When using at temperatures over Ta=25â, please refer to the power dissipation shown in Fig.20 through 22.
The IC characteristics are closely related to the temperature at which the IC is used, so if the temperature exceeds the
maximum junction temperature TjMAX, the device may malfunction or be destroyed. The heat of the IC requires sufficient
consideration regarding instantaneous destruction and long-term operation reliability. In order to protect the IC from thermal
damage, it is necessary to operate it at temperatures less than the maximum junction temperature TjMAX.
Even when the ambient temperature Ta is a normal temperature (25â), the chip(junction) temperature Tj may be quite high,
so please operate the IC at temperatures less than the acceptable loss Pd.
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TSZ22111ï½¥15ï½¥001
9/15
TSZ02201-0R6R0A600150-1-2
26.Jun.2012 Rev.001
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