BU28TD3WG-TR Datasheet, PDF (8/10 Pages) Rohm – Versatile Package FULL CMOS LDO Regulator

BUxxTD3WG series
Datasheet
z About power dissipation (Pd)
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of
IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the
original IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability.
Therefore, be sure to prepare sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
PMAX=(VIN-VOUT)×IOUT(MAX.) (VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current)
{ Measurement conditions
Standard ROHM Board
Layout of Board for
Measurement
IC
Implementation
Position
Top Layer (Top View)
Measurement State
Board Material
Board Size
Wiring
Rate
Top layer
Bottom
layer
Through Hole
Power Dissipation
Thermal Resistance
Bottom Layer (Top View)
With board implemented (Wind speed 0 m/s)
Glass epoxy resin (Double-side board)
70 mm x 70 mm x 1.6 mm
Metal (GND) wiring rate: Approx. 0%
Metal (GND) wiring rate: Approx. 50%
Diameter 0.5mm x 6 holes
0.54W
θja=185.2°C/W
0.6
0.5
0.54W
0.4
0.3
0.2
0.1
Standard ROHM
Board
* Please design the margin so that
PMAX becomes is than Pd (PMAX<Pd)
within the usage temperature range
0
0
25
50
75 85 100
125
Ta [℃]
Fig. 28 SSOP5 Power dissipation heat reduction characteristics (Reference)
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TSZ02201-0RBR0A300030-1-2
30.JUL.2013.Rev.002