BU4030B_13 Datasheet, PDF (7/16 Pages) Rohm – Quad 2-Input Exclusive-OR Gate

BU4030B BU4030BF
Typical Performance Curves - continued
500
400
300
Operating Temperature Range
V_DD=3V
Datasheet
200
V_DD=5V
100
V_DD=10V
V_DD=18V
0
-50 -25
0
25 50 75 100
Ambient Temperature [°C]
Figure 9. “H” to ”L” Propagation Delay Time t_PHL
Power Dissipation
Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25°C (normal temperature). IC is heated
when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal
resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame
of the package. The parameter which indicates this heat dissipation capability (hardness of heat release) is called thermal
resistance, represented by the symbol θja (°C /W).The temperature of IC inside the package can be estimated by this
thermal resistance. Figure 10 shows the model of thermal resistance of the package. Thermal resistance θja, ambient
temperature Ta, maximum junction temperature Tjmax, and power dissipation Pd can be calculated by the equation below:
θja = (Tjmax-Ta) / Pd (°C /W)
Derating curve in Figure 11 indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at
certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θja depends on chip
size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of
package is used. Thermal reduction curve indicates a reference value measured at a specified condition.
1.4
1.2
1.18
1.0
0.8
BU4030B (DIP14)
θja=(Tjmax-Ta)/Pd (°C /W)
Ambie^周nt^囲te^温m^度per^Ta^atu^[℃re^] Ta (℃)
0.6
0.56
0.4
0.2
BU4030BF (SOP14)
Chip surface temperature Tj (℃)
チップ 表面温度 Tj [℃]
Power dissipation Pd (W)
消費電力 P [W]
Figure 10. Thermal resistance
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TSZ22111・15・001
0.0
0
7/12
25
50
75 ⁸⁵ 100 125 150
Ambient Temperature [_℃]
Figure 11. Derating curve
TSZ02201-0RDR1GZ00040-1-2
09.Aug.2013 Rev.001