SML-D14A Datasheet, PDF (6/8 Pages) Rohm – Original device technology enables high brightness and high reliability

SML-D14(A) series
Data Sheet
lAttention Points In Handling
This product was developed as a surface mount LED especially suitable for reflow soldering.
Please take care of following points when using this device.
0.8mm
(Fig-1)
0.8mm
1.DESIGNING OF PCB
As for a recommendable solder pattern, Please refer to Fig-1.
The size and direction of the pad pattern depend on the condition of the PCB.
Thorough design review is recommended before the final designing
This product of structured with rear/bottom electrode to be soldered.
The formation of solder fillet is not guaranteed due to its electrode shape.
0.85mm
0.8mm
PCB Bonding Direction
2.SOLDERING (Sn-Cu, Sn-Ag-Cu, Sn-Ag-Bi-Cu)
LED products do not contain reinforcement
materials such as glass fillers.
Therefore, thermal stress by soldering greatly
influence its reliability.
The temperature conditions for reflow soldering
should therefore be set up according to the
characteristic of this product. (See Fig-2)
Number of reflow process shall be max 2 times
and these processes shall be performed in a row.
Cooling process to normal temperature shall be required
between first and second soldering process.
3.HANDLING AFTER MOUNTING (Fig-3)
As shown in the drawing on the right, in case outside force of
about 700g is given to the device, stress is concentrated to the
jointed part between mold resin and substrate.
Therefore there is a possibility to breath the device or PCB.
Careful handing is needed as ROHM cannot guarantee
the falling of the device by outside force after mounting.
Max.260ºC, Within 10sec
140 to 180ºC
230 to 260ºC
Min.1 min Max. 40sec
(Fig-2)
Outside Force
Emitting Direction
Mold
PCB
Substrate
Soldering part
(Fig-3)
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
6/7
2014.01 - Rev.A