CSL07 Datasheet, PDF (6/8 Pages) Rohm – Compact and lower height LEDs with lens

CSL07 Series
Data Sheet
3. Others
3-1. Surrounding Gas
Notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or alkali gas (ammonia), it
may result in low soldering ability (caused by the change in quality of the plating surface ) or optical
characteristics changes (light intensity, chrominance) and change in quality of die bonding (Ag-paste) materials.
All of the above will cause function failure of the products.
Therefore, please pay attention to the storage environment for mounted product (concern the generated gas of
the surrounding parts of the products and the atmospheric environment).
3-2. Electrostatic Damage
TThe product is part of semiconductor and electrostatic sensitive, there’s high possibility to be damaged by the
electrostatic discharge. Please take appropriate measures to avoid the static electricity from human body and
earthing of production equipment. The resistance values of electrostatic discharge (actual values) vary with
products, therefore, please call our Sales staffs for inquiries.
3-3. Electromagnetic Wave
Please concern the influence on LED in case of application with strong electromagnetic wave such as IH
(Induction heating).
4.Mounting
4-1. Soldering
•No resin hardening agent such as filler is used in the sealing resin of the product. Therefore, resin expansion
and moisture absorption at humidity will cause heat stress during soldering process and finally has bad
influence on the product’s reliability.
•The product is not for flow soldering.
•Do not expose the product in the environment of high temperature (over 100ºC) or rapid temperature shift
(within 3ºCof temperature gradient) during the flow soldering of surrounding parts.
•Please set appropriate reflow temperature based on our product usage conditions and specification.
•The max for reflowing is 2 times, please finish the second flow soldering and flow soldering with other parts
within the usage limitation after open the moistureproof package.
•Compare with N2 reflow, during air reflow, because of the heat and surrounding conditions, it may cause the
discoloration of the resin.
•For our product that has no solder resist, because of its solder amount and soldering conditions, one of its
specific characteristics is that solder will penetrate into LED. Thus, there's high possibility that will influence its
reliability. Therefore, please be informed, concerning it before using it.
4-2. Automatic Mounting
4-2-1.Silicon Resin Sealing Product
The sealing resin of LED is very soft, so please select adsorption nozzle that would not apply stress directly
on the sealing section
4-2-2.Mini Package (Smaller than 1608 size)
Vibration may result in low mounting rate since it will cause the static electricity of product and adhere to top
cover tape. We recommend to
• set magnet on parts feeder cassette of the mounter to control the product stabilization
• set ionizer to prevent electrostatic charge
4-3. Mounting Location
The stress like bending stress of circuit board dividing after mounting, may cause LED package crack or
damage of LED internal junction, therefore, please concern the mounting direction and position to avoid bending
or screwing with great stress of the circuit board.
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
6/7
2015.03 - Rev.B