BD63801EFV_12 Datasheet, PDF (6/9 Pages) Rohm – Stepping Motor Driver Series Standard 36V Stepping Motor Drivers

BD63801EFV
Technical Note
●Operation Notes
(1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may
result in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open
mode) when such damage is suffered. If operational values are expected to exceed the maximum ratings for the device,
consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC.
(2) Power supply polarity
Connecting the power supply with a reverse polarity can damage IC. Take precautions when connecting the power
supply lines. An external diode can be connected to the input for extra protection.
(3) Power supply lines
PCB design should allow for low-impedance GND and supply lines. To minimize noise on these lines, the GND section
and supply lines of the digital and analog blocks should be routed separately on the PCB. Furthermore, for all power IC
supply terminals, a capacitor should be connected between the power supply and GND terminal. If using electrolytic
capacitors, note that their capacitance values may be reduced at lower temperatures.
(4) GND potential
The potential of the GND pin must be the minimum potential in the system in all operating conditions. Ensure that no
pins are at a voltage below the GND at any time, regardless of transient characteristics.
(5) Backside heat slag
The metal heat slag integrated on the backside of the IC is connected internally with the backside of the IC die.
Therefore, it should always be connected to GND. Connecting to any other potential may cause malfunction or
destruction of the IC.
(6) Thermal design
Use a thermal design that allows for a sufficient margin for the package’s rated power dissipation (Pd) under actual
operating conditions. Keep in mind that the packaging of this IC series has been designed with an exposed heat slag on
the backside of the package, and that this heat slag should be soldered completely to as broad a GND pattern as
possible (on both the base fin of the slag as well as the entire backside) to improve heat dissipation.
(7) Inter-pin shorts and mounting errors
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in
damage to the IC. Shorts between output pins or between output pins and the power supply or GND pins (caused by
poor soldering or foreign objects) may result in damage to the IC.
(8) Operation in strong electromagnetic fields
Using this product in strong electromagnetic fields may cause IC malfunction. Caution should be exercised in applications
where strong electromagnetic fields may be present.
(9) ASO – Area of safe operation
When using the IC, ensure that operating conditions do not exceed absolute maximum ratings or ASO of the output
transistors.
(10) Thermal shutdown circuit
The IC incorporates a built-in thermal shutdown circuit, which is designed to force the motor output open if the IC’s
internal temperature exceeds Tjmax = 150°C. It is not designed to protect the IC from damage or guarantee its
operation. ICs should not be used after this function has activated, or in applications where the operation of this circuit
is assumed.
TSD on temperature [°C] (Typ.)
175
Hysteresis Temperature [°C] (Typ.)
25
(11) Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance pin may subject the IC to
stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be
turned off completely before connecting or removing it from a jig or fixture during the evaluation process. To prevent
damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
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2012.02 - Rev.A