BU92747GUW Datasheet, PDF (4/5 Pages) Rohm – Silicon Monolithic Integrated Circuit

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˔Notes for use
(1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range
may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open
mode) when such damage is suffered. A physical safety measure such as a fuse should be implemented when
use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated.
(2) Mutual impedance
Use short and wide wiring tracks for the power supply and ground to keep the mutual impedance
as small as possible .Use a capacitor to keep ripple to a minimum.
(3) GND potential
Ensure a minimum GND pin potential in all operating conditions.
(4) Short circuit mode between terminals and wrong mounting
In order to mount the IC on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous
mounting can destroy the IC. Furthermore, if a short circuit occurs due to foreign matters entering between
terminals or between the terminal and the power supply or the GND terminal, the IC can destroy
(5) Setting of heat
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating
conditions.
(6) Actions in strong magnetic field
Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to
malfunction.
(7) Ground Wiring Pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground
patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance
and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be
careful not to change the GND wiring pattern of any external components, either.
(8) When power is first supplied the CMOS IC, it is possible that the internal logic may be unstable and rush current
may flow instantaneously.
Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and
routing of connections.
(9) For ICs with more than one power, it is possible than rush current many flow instantaneously due to the internal

powering sequence and delays.
Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and
routing of wiring.
REV. A