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BU6577FV Datasheet, PDF (4/5 Pages) Rohm – Silicon monolithic integrated circuit
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●Cautions on use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down
devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding
the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses,
etc.
(2) Power supply and GND line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Pay attention to the
interference by common impedance of layout pattern when there are plural power supplies and GND lines. Especially, when
there are GND pattern for small signal and GND pattern for large current included the external circuits, separate each GND
pattern. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At
the same time, in order to use a capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no
problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(3) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
(4) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the
terminal and the power supply or the GND terminal, the ICs can break down.
(5) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(6) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals; such as to apply to the input terminals a
voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to
the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied,
apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical
characteristics.
(7) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(8) Rush current
For ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the internal
powering sequence and delays. Therefore, give special consideration to power coupling capacitance, power wiring, width of
GND wiring, and routing of wiring.
REV. A