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BU24026GU Datasheet, PDF (4/5 Pages) Rohm – Silicon monolithic integrated circuit | |||
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âPin assignment diagram (reverse side)
G
VDDAMP
OUTï¼B
MGNDï¼ï¼
OUTï¼A
MVCCï¼ï¼
OUTï¼A
OUTï¼B
F
SENSE
VDDAMP
SOï¼
STATEï¼
STATEï¼
OUTï¼B
OUTï¼B
E
OUTï¼A
DVSS
PIOUTï¼
STATEï¼
SIï¼
DVDD
OUTï¼A
D
RNF
PIOUT2
SDATA
CSB
INï¼ï¼
SOï¼
MGNDï¼ï¼
C
OUT7B
FCLK
SOï¼
INï¼
SIï¼
OUTï¼B
B
MGNDï¼
MVCC12
SCLK
SIï¼
SOUT
MVCCï¼ï¼
OUTï¼A
A
MVCC12
OUT1A
OUT1B
MGNDï¼ï¼
OUT2A
OUTï¼B
MVCCï¼ï¼
1
2
3
4
5
6
7
4/4
âOutline dimensions/Marking figure
ï¼µ24026
Lï½ï½ ï¼®ï½ï¼
VCSP85H3
âCautions on use
(1) Absolute maximum ratings
If applied voltage, operating temperature range, or other absolute maximum ratings are exceeded, the LSI may be damaged. Do not apply voltages or
temperatures that exceed the absolute maximum ratings. If you expect that any voltage or temperature could be exceeding the absolute maximum
ratings, take physical safety measures such as fuses to prevent any conditions exceeding the absolute maximum ratings from being applied to the LSI.
(2) GND potential
Maintain the GND pin at the minimum voltage even under any operating conditions.
Actually check to be sure that none of the pins have voltage lower than that of GND pin, including transient phenomena.
(3) Thermal design
With consideration given to the permissible dissipation under actual use conditions, perform thermal design so that adequate margins will be provided.
(4) Short circuit between pins and malfunctions
To mount the LSI on a board, pay utmost attention to the orientation and displacement of the LSI. Faulty mounting to apply a voltage to the LSI may
cause damage to the LSI. Furthermore, the LSI may also be damaged if any foreign matters enter between pins, between pin and power supply, or
between pin and GND of the LSI.
(5) Operation in strong magnetic field
Make a thorough evaluation on use of the LSI in a strong magnetic field. Not doing so may malfunction the LSI.
REV. A
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