BD9898FV Datasheet, PDF (4/5 Pages) Rohm – Silicon Monolithic Integrated Circuit

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〇NOTE FOR USE
１. This product is produced with strict quality control, but might be destroyed if used beyond its absolute
maximum ratings. Once IC is destroyed, failure mode will be difficult to determine, like short mode or
open mode. Therefore, physical protection countermeasure, like fuse is recommended in case operating
conditions go beyond the expected absolute maximum ratings.
２. The circuit functionality is guaranteed within of ambient temperature operation range as long as it is
within recommended operating range. The standard electrical characteristic values cannot be guaranteed
at other voltages in the operating ranges, however the variation will be small. When it is used in between
STB-UVLO Diode short etc., the IC can operate VCC≧9V. Please refer to a Technical Note in detail.
３. Mounting failures, such as misdirection or miscounts, may harm the device.
４. A strong electromagnetic field may cause the IC to malfunction.
５. The GND pin should be the location within ±0.3V compared with the PGND pin. ALL Pin (except BST1, BST2,
HN1, HN2,) Voltage should be under VCC voltage +0.3V
６. BD9898F, BD9898FV incorporate a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown
circuit (TSD circuit) is designed only to shut the IC off to prevent runaway thermal operation. It is not
designed to protect the IC or guarantee its operation of the thermal shutdown circuit is assumed.
７. When modifying the external circuit components, make sure to leave an adequate margin for external
components actual value and tolerance as well as dispersion of the IC.
８. About the external FET, the parasitic Capacitor may cause the gate voltage to change, when the drain voltage
is switching. Make sure to leave adequate margin for this IC variation.
９. Under operating CP charge (under error mode) analog dimming and burst dimming are not operate.
10. Under operating Slow Start Control (SS is less than 1.5V), It does not operate Timer Latch.
11. By STB voltage, BD9898F, BD9898FV are changed to 2 states. Therefore, do not input STB pin voltage between
one state and the other state (0.8～2.0V).
12. The pin connected a connector need to connect to the resistor for electrical surge destruction.
13. This IC is a monolithic IC which (as shown is Fig-1) has P⁺ substrate and between the various pins.
A P-N junction is formed from this P layer of each pin. For example, the relation between each potential
is as follows,
○(When GND > PinB and GND > PinA, the P-N junction operates as a parasitic diode.)
○(When PinB > GND > PinA, the P-N junction operates as a parasitic transistor.)
Parasitic diodes can occur inevitably in the structure of the IC. The operation of parasitic diodes can
result in mutual interference among circuits as well as operation faults and physical damage. Accordingly
you must not use methods by which parasitic diodes operate, such as applying a voltage that is lower than
the GND (P substrate) voltage to an input pin.
Resistance
(PinA)
P^＋
ï¼®
P
P^＋
N
P substrate
GND
Parasitic diode
Transistor (NPN)
(PinB)
B
C_ï¼£
E
N
GND
N
N
ï¼®
P substrate
GND
Parasitic diode
(PinB)
(PinA)
Parasitic diode
B
C
ï¼¢
ï¼£
E_ï¼¥
GND
GND
Other adjacent components _{Parasitic diode}
Fig-1 Simplified structure of a Bipolar IC
REV. B