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BD90640HFP-CTR Datasheet, PDF (32/44 Pages) Rohm – 1ch Step-Down Switching Regulator | |||
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BD906xx-C series
Power Dissipation
For thermal design, be sure to operate the IC within the following conditions.
(Since the temperatures described hereunder are all guaranteed temperatures, take margin into account.)
1. The ambient temperature Ta is to be 125 °C or less.
2. The chip junction temperature Tj is to be 150 °C or less.
The chip junction temperature Tj can be considered in the following two patterns:
â To obtain Tj from the package surface center temperature Tt in actual use
í µí±í µí± = í µí±í µí±¡ + í µí¼í µí°½í µí± Ã í µí±
â¡ To obtain Tj from the ambient temperature Ta
í µí±í µí± = í µí±í µí± + í µí¼í µí±í µí± Ã í µí±
ï¼Reference Valueï¼
HRP7
ï¼Reference Valueï¼
θjc
Top : 22 °C / W
Bottom : 2 °C / W
θja
95.3 °C / W 1-layer PCB
17.9 °C / W 4-layer PCB
ÏJT
5 °C / W 1-layer PCB
1 °C / W 4-layer PCB
PCB Size 114.3 mm x 76.2 mm x 1.60 mmt
HTSOP-J8
θjc
Top : 44 °C / W
Bottom : 14 °C / W
θja
189.4 °C / W 1-layer PCB
40.3 °C / W 4-layer PCB
ÏJT
21°C / W 1-layer PCB
5°C / W 4-layer PCB
PCB Size 114.3 mmx76.2 mm x 1.60 mmt
The heat loss W of the IC can be obtained by the formula shown below:
í µí±
=
í µí±
ON
Ã
í µí°¼í µí± 2
Ã
í µí±í µí±
í µí±í µí°¼í µí±
+
í µí±í µí°¼í µí±
Ã
í µí°¼í µí°¼í µí±
+
1
2
Ã
(í µí±í µí±
+
í µí±í µí±)
Ã
í µí±í µí°¼í µí±
Ã
í µí°¼í µí±
Ã
í µí±í µí± í µí±¤
Where:
RON is the ON Resistance of IC (Refer to page 7) [Ω]
IO is the Load Current [A]
VO is the Output Voltage [V]
VIN is the Input Voltage [V]
IIN is the Circuit Current (Refer to page 7) [A]
Tr is the Switching Rise Time [s] (Typ:17ns)
Tf is the Switching Fall Time [s] (Typ:17ns)
fsw is the Switching Frequency [Hz]
Tr
(17 ns)
Tf
(17 ns)
â
VIN
SW wave form
GND
T=
1
fsw
â¡
â í µí±
í µí±í µí± Ã í µí°¼í µí±2
1
1
â¡ 2 à (í µí±í µí± + í µí±í µí±) Ã í µí±í µí°¼í µí± Ã í µí°¼í µí± Ã í µí±
= í µí±í µí± Ã í µí±í µí°¼í µí± Ã í µí°¼í µí± Ã í µí±í µí± í µí±¤
SW Wave Form
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TSZ02201-0T1T0AL00130-1-2
15.Sep.2015 Rev.005
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