BU24038GW Datasheet, PDF (3/4 Pages) Rohm – Silicon monolithic integrated circuit

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◇Pin functions
◇Outline dimensions/Marking figure
Land Matrix No. Pin name Power supply
Function
H8
H9
G2
H4
E2
H3
D2
H5
E8
F8
G9
G8
H6
J9
H7
F2
C2
B3
B4
B5
B6
B7
A8
D8
C8
C9
E9
A9, B8
B9
D9
DVDD
DVSS
RESETB
FCLK
CSB
SCLK
SDATA
SOUT
IN1
IN2
STATE1
STATE2
STATE3
TEST
PIOUT1
PIOUT2
PIOUT3
SI1
SO1
SI2
SO2
SI3
SO3
SI4
SO4
MVCC12
MGND12
OUT1A
OUT1B
OUT2A
-
-
DVDD
DVDD
DVDD
DVDD
DVDD
DVDD
DVDD
DVDD
DVDD
DVDD
DVDD
DVDD
DVDD
DVDD
DVDD
DVDD
DVDD
DVDD
DVDD
DVDD
DVDD
DVDD
DVDD
-
-
MVCC12
MVCC12
MVCC12
Digital power supply
ground
RESETB logic input
FCLK logic input
CSB logic input
SCLK logic input
SDATA logic input
SOUT logic output
IN1 logic input
IN2 logic input
STATE1 logic input/output
STATE2 logic input/output
STATE3 logic input/output
TEST logic input
PI driving output 1
PI driving output 2
PI driving output 3
Waveforming input1
Waveforming output1
Waveforming input2
Waveforming output2
Waveforming input3
Waveforming output3
Waveforming input4
Waveforming output4
1ch, 2ch Driver power supply
1ch, 2ch Driver ground
1ch Driver A output
1ch Driver B output
2ch Driver A output
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UCSP75M3
F9
A2
A7
A3
A4
A5
A6
J8
J4
J7
J6
J3
J2
J5
H1
G1
H2, J1
F1
B1
A1, B2
E1
D1
C1
OUT2B
MVCC34
MGND34
OUT3A
OUT3B
OUT4A
OUT4B
MVCC567
MGND567
OUT5A
OUT5B
OUT6A
OUT6B/7B
OUT7A
MVCC8
MGND8
OUT8A
OUT8B
VDDAMP
RNF9
MGND9
OUT9A
OUT9B
MVCC12
-
-
MVCC34
MVCC34
MVCC34
MVCC34
-
-
MVCC567
MVCC567
MVCC567
MVCC567
MVCC567
-
-
MVCC8
MVCC8
-
-
-
RNF9
RNF9
2ch Driver B output
3ch, 4ch Driver power supply
3ch, 4ch Driver ground
3ch Driver A output
3ch Driver B output
4ch Driver A output
4ch Driver B output
5ch, 6ch, 7ch Driver power supply
5ch, 6ch, 7ch Driver ground
5ch Driver A output
5ch Driver B output
6ch Driver A output
6ch, 7ch Driver B output
7ch Driver A output
8ch Driver power supply
8ch Driver ground
8ch Driver A output
8ch Driver B output
9ch Power supply of current driver control
9ch Driver power supply
9ch Driver ground
9ch Driver A output
9ch Driver B output
◇Pin assignment diagram (bottom view)
J
OUT8A OUT6B/7B OUT6A MGND567 OUT7A
OUT5B
OUT5A MVCC567 TEST
H
MVCC8
OUT8A
SCLK
FCLK
SOUT
STATE3 PIOUT1
DVDD
DVSS
G
MGND8
RESETB
STATE2 STATE1
F
OUT8B
PIOUT2
IN2
OUT2B
E
MGND9
CSB
IN1
MGND12
D
OUT9A
SDATA
SI4
OUT2A
C
OUT9B
PIOUT3
SO4
MVCC12
B VDDAMP
RNF9
SI1
SO1
SI2
SO2
SI3
OUT1A
OUT1B
A
RNF9
MVCC34 OUT3A
OUT3B
OUT4A
OUT4B MGND34
SO3
OUT1A
1
2
3
4
5
6
7
8
9
（*）It is not possible to use corner pin only.(Corner pins are A1, A9, and J1.) Please short A1-B2, A9-B8, J1-H2 or use B2, B8, H2 only.
◇Cautions on use
(1)Absolute maximum ratings
If applied voltage, operating temperature range, or other absolute maximum ratings are exceeded, the LSI may be damaged. Do not apply voltages or temperatures that
exceed the absolute maximum ratings. If you expect that any voltage or temperature could be exceeding the absolute maximum ratings, take physical safety
measures such as fuses to prevent any conditions exceeding the absolute maximum ratings from being applied to the LSI.
(2)GND potential
Maintain the GND pin at the minimum voltage even under any operating conditions.
Actually check to be sure that none of the pins have voltage lower than that of GND pin, including transient phenomena.
(3)Thermal design
With consideration given to the permissible dissipation under actual use conditions, perform thermal design so that adequate margins will be provided.
(4)Short circuit between pins and malfunctions
To mount the LSI on a board, pay utmost attention to the orientation and displacement of the LSI. Faulty mounting to apply a voltage to the LSI may cause damage
to the LSI. Furthermore, the LSI may also be damaged if any foreign matters enter between pins, between pin and power supply, or between pin and GND of the LSI.
(5)Operation in strong magnetic field
Make a thorough evaluation on use of the LSI in a strong magnetic field. Not doing so may malfunction the LSI.
REV. A