BM92T20MWV Datasheet, PDF (27/32 Pages) Rohm – Type-C USB Power Delivery Controller

BM92T20MWV
9 Operational Notes
(1) Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting
the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins.
(2) Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and
analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore,
connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value
when using electrolytic capacitors.
(3) Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
(4) Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected
to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large
currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground
lines must be as short and thick as possible to reduce line impedance.
(5) Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of
the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent
exceeding the Pd rating.
(6) Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The
electrical characteristics are guaranteed under the conditions of each parameter.
(7) Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of
connections.
(8) Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
(9) Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to
stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off
completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static
discharge, ground the IC during assembly and use similar precautions during transport and storage.
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16, Jul.2015, Rev.001