BM60052FV-C_15 Datasheet, PDF (27/39 Pages) Rohm – Isolation voltage 2500Vrms 1ch Gate Driver Providing Galvanic Isolation

BM60052FV-C
Selection of Components Externally Connected
Recommended
ROHM
MCR03EZP
Recommended
SUMIDA
CEER117
Recommended
ROHM
MCR100JZH
LTR50UZP
Recommended
ROHM
MCR03EZP
Recommended
ROHM
RB168M150
Recommended
ROHM
LTR18EZP
Recommended
ROHM
RSR025N05
Figure 45. Recommended External Parts
Power Dissipation
1.5
1.25
1
Measurement machine : TH156 (Kuwano Electric)
Measurement condition : ROHM board
Board size : 114.3×76.2×1.6mm³
1-layer board : θja=111.1°C /W
0.75
0.5
0.25
0
0
25
50
75
100
125
150
175
Ambient Temperature : Ta [℃]
Figure 46. SSOP-B28W Derating Curve
Thermal Design
Please make sure that the IC’s chip temperature Tj is not over 150°C, while considering the IC’s power consumption (W),
package power (Pd) and ambient temperature (Ta). When Tj=150°C is exceeded, the IC may malfunctions or some problems
(ex. abnormal operation of various parasitic elements and increasing of leak current) may occur. Constant use under these
circumstances leads to deterioration and eventually IC may destruct. Tjmax=150°C must be strictly obeyed under all
circumstances.
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TSZ22111・15・001
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TSZ02201-0818ABH00060-1-2
25.Dec.2015 Rev.002