BD9A301MUV-LB Datasheet, PDF (26/35 Pages) Rohm – This is the product guarantees long time support in Industrial market

BD9A301MUV-LB
Datasheet
Power Dissipation
When designing the PCB layout and peripheral circuitry, sufficient consideration must be given to ensure that the power
dissipation is within the allowable dissipation curve.
This package incorporates an exposed thermal pad. Solder directly to the PCB ground plane. After soldering, the PCB can
be used as a heatsink.
The exposed thermal pad dimensions for this package are shown in page 31.
4.0
3.0
①2.66W
2.0 _②1.77W
1.0 _③0.62W
④0.27W
0
0 25 50
7585 100
125 150
Ambient temperature: Ta [°C]]
Figure 56. Thermal Derating Characteristics
(VQFN016V3030)
(1)4-layer board (surface heat dissipation copper foil 5505mm2)
(copper foil laminated on each layer)
 _JA=47.0°C/W
(2) 4-layer board (surface heat dissipation copper foil 6.28mm²)
(copper foil laminated on each layer)
 _JA=70.62°C/W
(3) 1-layer board (surface
heat
dissipation
copper
foil
6.28mm²)
 _JA=201.6°C/W
(4) IC only
 _JA=462.9°C/W
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TSZ02201-0J3J0AJ00680-1-2
20.Aug.2014 Rev.001