BD34700FV Datasheet, PDF (21/31 Pages) Rohm – Micro-step volume can reduce the switching pop noise when volume changes

BD34700FV
Datasheet
Power Dissipation
About the thermal design by the IC
Characteristics of an IC have a great deal to do with the temperature at which it is used, and exceeding absolute maximum
ratings may degrade and destroy elements. Careful consideration must be given to the heat of the IC from the two
standpoints of immediate damage and long-term reliability of operation.
Reference data
SSOP-B40
Measurement condition: ROHM Standard board
board Size：70×70×1.6(㎣)
2.0
material：A FR4 grass epoxy board
(3% or less of copper foil area)
1.12W
θja = 111.1°C/W
1.0
0.0
0
85
25
50
75
100
Ambient Temperature Ta(°C)
125 150
Figure 14. Temperature Derating Curve
Note) Value is actual measurements and is not guaranteed.
Power dissipation values vary according to the board on which the IC is mounted.
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TSZ22111・15・001
21/27
TSZ02201-0C2C0E100060-1-2
06.Aug.2014 Rev.001