PSR Datasheet, PDF (2/9 Pages) Rohm – Ultra low ohmic metal plate

PSR series
●Characteristics
Test items
Resistance
Guaranteed value
Resistor type
F ( ±1% )
Datasheet
Test conditions
Measuring method : 4probe per Bottom terminal
Variation of resistance
with temperature
Overload
Solderability
Resistance to
soldering heat
Rapid change of
temperature
Damp heat, steadystate
ENDURANCE AT 140℃
(terminal temperature)
(PSR100)
ENDURANCE AT 70℃
(ambient temperature)
Endurance at 170℃
See P1
Measurement：+20/+125℃
±0.5％
Rated power×5， 5s
Anew uniform coating of minimum of 95% of
the surface being immersed and no
soldering damage.
Flux：Rosin- Ethanol solution(25%weight)
with diethylamine hydrochloride(3%weight)
Soldering condition：245±5℃
Duration of immersion：2.0±0.5s
±1.0％
Soldering condition：260±5℃
No remarkable abnormalityon the appearance. Duration of immersion：10±1s
±1.0％
Test temp：-55℃～+155℃ 5cycle
±0.5％
±1.0％
±1.0％
±1.0％
40 ℃，93％(Relative humidity)
Test time：1,000h～1,048h
Terminal temperature:140℃,Rated power
1.5h:ON－0.5h:OFF
Test time：1,000h～1,048h
Ambient temperature:70℃,Rated power
1.5h:ON－0.5h:OFF
Test time：1,000h～1,048h
170℃
Test time：1,000h～1,048h
Component solvent
Resistance
Bend strength of
the end face plating
●Solder conditions
±0.5％
Without open
23±5℃, Immersion cleaning, 10±1s．
Solvent: 2-propanol
-
Compliance Standard(s) : IEC60115-8
JISC 5201-1
Recommeded solder profile
Reflow
Temperature(℃) 260
220 150～180
Time(s)
Peak
10s Max.
60s
120s
(Note) About flow soldering
① This part has the structure that resistive element exposed.
Therefore, the solder may be attached to resistive element if
Flow soldering is used, and resistance value may be outside
of the spec.
② This part is ultra low ohmic resistoe.If the solder is not equally
attached on the whole area between the bottomelectrode
and land pattem, resistance value may be outside of the
spec.
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2/5
2017.06 - Rev.G