BU6650NUX_11 Datasheet, PDF (19/22 Pages) Rohm – 3ch CMOS LDO Regulators

BU6650NUX,BU6651NUX,BU6652NUX,BU6653NUX,BU6654NUX,BU6655NUX Technical Note
●About power dissipation (Pd)
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of
IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original
IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability. Therefore, be
sure to prepare sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
PMAX=(VIN-VOUT1)×IOUT1(MAX.)＋(VIN-VOUT2)×IOUT2(MAX.)＋(VIN-VOUT3)×IOUT3(MAX.)
(VIN : Input voltage VOUT1,2,3 : Output voltage IOUT(MAX) : Maximum output current)
0.7
0.6
0.66W
0.5
0.4
0.3
0.2
0.1
0
0
25
50
75 85 100
125
Ta [℃]
* Please design the margin so that PMAX
becomes is than Pd (PMAXPd) within
the usage temperature range.
- Standard ROHM board -
Size: 70 mm  70 mm  1.6 mm
Material : Glass epoxy board
Fig.124 VSON008X2030 Power dissipation heat reduction characteristics (Reference)
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19/21
2011.03 - Rev.E