BM67220FV-C Datasheet, PDF (19/28 Pages) Rohm – High Speed Digital Isolator 2500 Vrms 2ch

BM67220FV-C
Power Dissipation Reduction Characteristics
1.5
1.19W
1.0
Measuring equipment: TH156 (Kuwano Electric)
Measuring condition: Mounted on the ROHM’s board
Board size: 70  70  1.6 mm³
Single-layer board: ja  105.3C/W
0.5
0
0
25
50
75
100
125
150
A^Am^mbi^beⁱn^etⁿT^t e^Tm^empe^pr^ea^rt^au^tr^ue^r:^eT^:Ta^a[^[°^℃C]^]
Figure 38. SSOP-B20W Power Dissipation Reduction Curve
Thermal Dissipation
In consideration of the power consumption (P), package power dissipation (Pd), and ambient temperature (Tj) of this IC,
ensure that the operating temperature of the chip will not exceed 150C. If Tj is beyond 150C, parasitic elements may
malfunction and may cause leakage current to increase. Constantly using the IC under the said conditions may deteriorate
the IC and further lead to its breakdown. Strictly keep Tjmax at 150C under any circumstances.
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TSZ22111・15・001
19/24
TSZ02201-0727ABG00010-1-2
25.Dec.2015 Rev.005