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| BD9D321EFJ Datasheet, PDF (19/28 Pages) Rohm – 4.5V to 18V Input, 3.0A Integrated MOSFET 1ch Synchronous Buck DC/DC Converter | |||
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BD9D321EFJ
Datasheet
Power Dissipation
When designing the PCB layout and peripheral circuitry, sufficient consideration must be given to ensure that the power
dissipation is within the allowable dissipation curve.
HTSOP-J8 Package
70 ï´ 70 ï´ 1.6 mm assembled glass epoxide board
(1) 4-layer board (Copper foil area 70 mm ï´ 70 mm)
(2) 2-layer board (Copper foil area 70 mm ï´ 70 mm)
(3) 2-layer board (Copper foil area 15 mm ï´ 15 mm)
(4) 1-layer board (Copper foil area 0 mmï´ 0 mm)
Figure 34. Power dissipation (HTSOP-J8)
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111â¢15â¢001
19/25
TSZ02201-0J3J0AC00490-1-2
07.Aug.2013 Rev.001
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