LM393MX_11 Datasheet, PDF (15/17 Pages) Rohm – NOW SERIES Comparators

LM393MX,LM2903MX,LM339MX,LM2901MX
●Derating Curves
800
Technical Note
NOW SERIES LM2903/2901/393/339 family
1000
600
LM393MX
LM2903MX
400
200
800
600
LM2901MX
400
LM339MX
200
0
70
85
0
25
50
75
100
AMBIENT TEMPERATURE [℃]
LM393MX, LM2903MX
Power Dissipation
Package
Pd[W]
θja [℃/W]
SO package8 (*8)
450
3.6
θja = (Tj-Ta)/Pd[℃/W]
0
70 85
0
25
50
75
100
AMBIENT TEMPERATURE [℃]
LM339MX, LM2901MX
Power Dissipation
Package
Pd[W]
θja [℃/W]
SO package14
610
4.9
θja = (Tj-Ta)/Pd[℃/W]
Fig.102 Derating Curves
●Notes for use
1) Unused circuits
When there are unused circuits it is recommended that they be connected as in Fig. 103,
setting the non-inverting input terminal to a potential within the in-phase input voltage
range (VICR).
2) Input terminal voltage
Applying GND + 36V to the input terminal is possible without causing deterioration of
the electrical characteristics or destruction, irrespective of the supply voltage. However,
this does not ensure normal circuit operation. Please note that the circuit operates
normally only when the input voltage is within the common mode input voltage range of
the electric characteristics.
V⁺
－
＋
GND
Fig.103
3) Power supply (single / dual)
The op-amp operates when the specified voltage supplied is between V⁺ and GND. Therefore, the single supply
op-amp can be used as a dual supply op-amp as well.
4) Power dissipation Pd
Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to a rise
in chip temperature, including reduced current capability. Therefore, please take into consideration the power
dissipation (Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal
derating curves for more information.
5) Short-circuit between pins and erroneous mounting
Incorrect mounting may damage the IC. In addition, the presence of foreign particles between the outputs, the output
and the power supply, or the output and GND may result in IC destruction.
6) Terminal short-circuits
When the output and V⁺ terminals are shorted, excessive output current may flow, resulting in undue heat generation
and, subsequently, destruction.
7) Operation in a strong electromagnetic field
Operation in a strong electromagnetic field may cause malfunctions.
8) Radiation
This IC is not designed to withstand radiation.
9) IC handing
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical
characteristics due to piezoelectric (piezo) effects.
10) Board inspection
Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every
process is recommended. In addition, when attaching and detaching the jig during the inspection phase, ensure that
the power is turned OFF before inspection and removal. Furthermore, please take measures against ESD in the
assembly process as well as during transportation and storage.
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2011.06 - Rev.C