BD3464FV Datasheet, PDF (15/30 Pages) Rohm – General-Purpose 4ch Electronic Volume with Built-in Advanced Switch

BD3464FV
Power Dissipation
About the thermal design by the IC
Characteristics of an IC have a great deal to do with the temperature at which it is used, and exceeding absolute
maximum ratings may degrade and destroy elements. Careful consideration must be given to the heat of the IC from the
two standpoints of immediate damage and long-term reliability of operation.
Reference data
1.5
SSOP-B20
1.0 ^0.81W
Measurement condition: ROHM Standard board
board Size : 70 x 70 x 1.6 (mm³)
material : A FR4 grass epoxy board
(3% or less of copper foil area)
θja = 153.8°C/W
0.5
0.0
0
85
25 50 75 100 125 150
Ambient Temperature : Ta (°C)
Figure 18. Temperature Derating Curve (SSOP-B20)
(Note) Values are actual measurements and are not guaranteed.
Power dissipation values vary according to the board on which the IC is mounted.
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TSZ22111・15・001
15/26
TSZ02201-0C2C0E100370-1-2
16.Dec.2015 rev.001