BD9329AEFJ Datasheet, PDF (14/16 Pages) Rohm – Simple Step-down Switching Regulator with Built-in Power MOSFET

BD9329AEFJ
Technical Note
10) Thermal shutdown circuit (TSD)
This IC incorporates a built-in TSD circuit for the protection from thermal destruction. The IC should be used within the
specified power dissipation range. However, in the event that the IC continues to be operated in excess of its power
dissipation limits, the attendant rise in the chip's junction temperature Tj will trigger the TSD circuit to turn off all output
power elements. Operation of the TSD circuit presumes that the IC's absolute maximum ratings have been exceeded.
Application designs should never make use of the TSD circuit.
11) Testing on application boards
At the time of inspection of the installation boards, when the capacitor is connected to the pin with low impedance, be sure
to discharge electricity per process because it may load stresses to the IC. Always turn the IC's power supply off before
connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as
an antistatic measure, and use similar caution when transporting or storing the IC.
12) EN control speed
Chattering happens if standing lowering speed is slow when standing of EN pin is lowered. The reverse current in which
the input side and the pressure operation are done from the output side is generated when chattering operates with the
output voltage remained, and there is a case to destruction. Please set to stand within 100µs when you control ON/OFF by
the EN signal.
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2011.02 - Rev.A