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BD9109FVM-LB Datasheet, PDF (14/23 Pages) Rohm – Synchronous Buck Converter Integrated FET | |||
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BD9109FVM-LB
Switching Regulator Efficiency
Efficiency Å may be expressed by the equation shown below:
η= VOUTÃIOUT Ã100[%]= POUT Ã100[%]=
VinÃIin
Pin
POUT
Ã100[%]
POUT+PDα
Efficiency may be improved by reducing the switching regulator power dissipation factors PDα as follows:
Dissipation factors:
1) ON resistance dissipation of inductor and FETï¼PD(I2R)
2) Gate charge/discharge dissipationï¼PD(Gate)
3) Switching dissipationï¼PD(SW)
4) ESR dissipation of capacitorï¼PD(ESR)
5) Operating current dissipation of ICï¼PD(IC)
1)PD(I2R)=IOUT2Ã(RCOIL+RON) (RCOIL[Ω]ï¼DC resistance of inductor, RON[Ω]ï¼ON resistance of FETIOUT[A]ï¼Output current.)
2)PD(Gate)=CgsÃfÃV2 (Cgs[F]ï¼Gate capacitance of FET,f[Hz]ï¼Switching frequency,V[V]ï¼Gate driving voltage of FET)
Vin2ÃCRSSÃIOUTÃf
3)PD(SW)=
IDRIVE
(CRSS[F]ï¼Reverse transfer capacitance of FETãIDRIVE[A]ï¼Peak current of gate.)
4)PD(ESR)=IRMS2ÃESR (IRMS[A]ï¼Ripple current of capacitor,ESR[Ω]ï¼Equivalent series resistance.)
5)PD(IC)=VinÃICC (ICC[A]ï¼Circuit current.)
Power Dissipation
As this IC functions with high efficiency without significant heat generation in most applications, no special consideration is
needed on permissible dissipation or heat generation. In case of extreme conditions, however, including lower input
voltage, higher output voltage, heavier load, and/or higher temperature, the permissible dissipation and/or heat generation
must be carefully considered.
For dissipation, only conduction losses due to DC resistance of inductor and ON resistance of FET are considered.
Because the conduction losses are considered to play the leading role among other dissipation mentioned above including
gate charge/discharge dissipation and switching dissipation.
1000
800
â 587.4mW
600
â¡387.5mW
400
â mounted on glass epoxy PCB
θja=212.8°C/W
â¡Using an IC alone
θja=322.6°C/W
P=IOUT2Ã(RCOIL+RON)
RON=DÃRONP+(1-D)ÃRONN
Dï¼ON duty (=VOUT/VCC)
RCOILï¼DC resistance of coil
RONPï¼ON resistance of P-channel MOS FET
RONNï¼ON resistance of N-channel MOS FET
IOUTï¼Output current
200
0
0 25 50 75 85 100 125 150
Ambient temperature:Ta [â]
Figure 34. Thermal derating curve
(MSOP8)
If VCC=5V, VOUT=3.3V, RCOIL=0.15Ω, RONP=0.35Ω, RONN=0.25Ω,IOUT=0.8A, for example,
D=VOUT/VCC=3.3/5=0.66
RON=0.66Ã0.35+(1-0.66)Ã0.25
=0.231+0.085
=0.316[Ω]
P=0.82Ã(0.15+0.316)
â298[mV]
As RONP is greater than RONN in this IC, the dissipation increases as the ON duty becomes greater. With the
consideration on the dissipation as above, thermal design must be carried out with sufficient margin allowed.
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TSZ22111 ⢠15 ⢠001
14/20
TSZ02201-0J4J0AJ00600-1-2
21.Feb.2014 Rev.002
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