BD8205EFV-M Datasheet, PDF (13/23 Pages) Rohm – 5ch System Motor Driver for Car AV

BD8205EFV-M
Power Dissipation
(4) 3.99W
(3) 2.80W
(2) 1.70W
(1) 1.10W
Figure 16. Power Dissipation
<Conditions>
・Power dissipation calculated when IC is mounted on a 70mm × 70mm × 1.6mm glass epoxy substrate.
(Power dissipation changes with the copper foil density of the board.)
・The board and the IC’s bottom thermal plate are solder-connected.
Board (1): 1-layer board (copper foil 0mm × 0mm)
Board (2): 2-layer board (copper foil 15mm × 15mm)
Board (3): 2-layer board (copper foil 70mm × 70mm)
Board (4): 4-layer board (copper foil 70mm × 70mm)
Board (1): θja = 113.6 °C/W
Board (2): θja = 73.5 °C/W
Board (3): θja = 44.6 °C/W
Board (4): θja = 31.3 °C/W
At Ta=85°C:
Board (1): Pd = 0.57W
Board (2): Pd = 0.88W
Board (3): Pd = 1.45W
Board (4): Pd = 2.07W
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TSZ22111 • 15 • 001
13/19
TSZ02201-0P5P0BK00810-1-2
04.Dec.2014 Rev.001