SML-A12V8T Datasheet, PDF (11/13 Pages) Rohm – Compact size side-view LEDs

[SML-A1x series]
　　　　
[Data Sheet]
４－６．Reflow Profile
For reflow profile, please refer to the conditions below:(※)
■Meaning of marks, Conditions
Mark
Meanings
Conditions
Ts_max
Maximum of pre-heating temperature
180℃
Ts_min
Minimum of pre-heating temperature
140℃
t_s
Time from Tsmin to Tsmax Over 60sec.
T_L
Reference temperature 230〜260℃
t_L
Retention time for TL Within 40sec.
T_P
Peak temperature
260℃(Max)
t_P
Time for peak temperature Within 10sec.
ΔT_R/Δt Temperature rising rate Under 3℃/sec.
ΔT_D/Δt
Temperature decreasing rate Over -3℃/sec.
※Above conditions are for reference. Therefore, evaluate by customer’s own circuit boards and
reflow furnaces before using, because stress from circuit boards and temperature variations of reflow
furnaces vary by customer’s own conditions.
４－７．Attention Points in Soldering Operation
This product was developed as a surface mount LED especially suitable for reflow soldering.
So reflow soldering is recommended. In case of implementing manual soldering,
please take care of following points.
①SOLDER USED
Sn-Cu，Sn-Ag-Cu，Sn-Ag-Bi-Cu
②HAND SOLDERING CONDITION
LED products do not contain reinforcement material such as a glass fillers.
So thermal stress by soldering greatly influence its reliability.
Please keep following points for manual soldering.
ITEM
RECOMMENDED CONDITION
Condition ) Temp. of iron top less than
a)
Heating
method
Heating
on
400℃ within 3 sec.
PCB pattern, not direct
to
the
LED. (Fig-1)
b)
Handling after Please handle after the part temp.
soldering goes down to room temp.
Fig-1
SOLDERING IRON
SOLDERING
LAND
４－８．Cleaning after Soldering
Please follow the conditions below if the cleaning is necessary after soldering.
Solvent
We recommend to use alcohols solvent such as, isopropyl alcohols
Temperature
Under 30℃ within 3 minutes
Ultrasonic Cleaning
15W／Below 1 liter (capacity of tank)
Drying
Under 100℃ within 3 minutes
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11/11
2017.7 - Rev.007