SML-812BCT Datasheet, PDF (1/3 Pages) Rohm – Reverse Mount Chip LEDs High Brightness Type

Reverse Mount Chip LEDs
1305 <3.4 1.25 t=1.1mm> High Brightness Type
SML-812 Series
Reverse
Mount
Emitting Color
Material
Package Size(mm)
Blue
InGaN on SiC
Green(Yellowish Green)
AlGaInP on GaAs
3412(1305) 3.4×1.25(t=1.1)
Part No.
SML-812BCT
Absolute Maximum Ratings (Ta=25°C)
Part No.
Emitting
color
Power Forward
dissipation current
PD
IF
(mW) (mA)
Peak
forward
current
IFP
(mA)
Reverse Operating Storage
voltage temperature temperature
VR
Topr
Tstg
(V)
(°C)
(°C)
SML-812BCT Blue
80
SML-812MT
Green
(Yellowish Green)
65
1:Duty 1/10, 1kHz.
2:Duty 1/5, pulse width 1ms.
20
100^∗1
5
25
60^∗2
4
-30 to +85 -40 to +85
Electrical Optical Characteristics (Ta=25°C)
Part No.
Forward
voltage
Resin Color
VF
Reverse
current
IR
Typ. IF Max. VR
(V) (mA) (µA) (V)
SML-812BCT Transparent 3.3 _{20 100} 5
SML-812MT Colorless 2.1
4
Light wavelength
Peak Half-wave
λp ∆λ
Typ. Typ. IF
(nm) (nm) (mA)
Brightness
IV
Min. Typ. IF
(mcd) (mcd) (mA)
468 26
22 56
20
20
570 18
14 40
Recommended Pad Layout
1.25
Packaging Specifications (Unit:mm)
Tape Specifications:T86 <3,000pcs/reel>
4± 0.1
2± 0.05
Feeding direction
φ 1.5
+0.1
0
SML-812MT
Dimensions (Unit:mm)
3.4
1.2
R1.25
4-R0.3 ^{LED Die}
Resist
Cathode mark
Tolerance:± 0.1
1.8
Terminal
Directivity (Typ.)
X
Y
Angular Displacement (deg)
0°
30°
30°
SML-812MT
SML812BCT
60°
60°
90°
100
50
0
50
RELATIVE LUMINOUS INTENSITY (%)
90°
100
Angular Displacement (deg)
X’
Y’
0°
SML-812MT
30°
30°
SML812BCT
60°
60°
90°
100
50
0
50
RELATIVE LUMINOUS INTENSITY (%)
90°
100
Reel Specifications
(Unit:mm)
The recommended thickness of the screen mask
for soldering is between 100 and 150µm. The
hole size of the screen mask should be same as
the recommended land pattern or smaller.
Tolerance:± 0.2
1.5
1.2
11.4±1
Label Position
Tolerance:± 0.2
Rev.D