LF-301 Datasheet, PDF (1/1 Pages) Rohm – Solder Profile and Pattern

Solder Profile and Pattern
1) Dip Types (LA, LB ,LAP,LBP series)
Please keep the preheat and peak temperatures with dip units as low as possible and the times as short as
is feasible, since the products are susceptible to heat during flow soldering. As a guide, ensure that the
internal temperature of the LED numeric display does not exceed 100°C.
300
250
200
150
100
50
0
0
Soldering Example
3s or less
A single wave is better than a double wave, while
stationary flow method is the best.
260°C or less
After soldering, immediately lower
the temperature of the substrate
Preheat 30s
or less
Conditions
General
flow conditions
20
40
60
80
100
120
140
Time (s)
Solder Pattern Example
LA-301 series
φ1.5 ^+00.1land shape
φ0.8 ^+00.1hole shape
Other series
φ2.0 ^+00.1land shape
φ1.0 ^+00.1hole shape
Item
Conditions
Solder dip At least 2mm from the base of the lead pin.
Solder Temperature
Preheat temperature must
be no greater than 80°C.
No more than 260°C.
Process Duration
30 seconds or less
3 seconds or less
Solder iron
At least 2mm from the base of the lead pin.
Power: No more than 30W.
No more than 300°C.
3 seconds or less
Reflow
Reflow cannot be used. (other than the LF-301 series)
∗^{Please use a resin-based flux, since flux that is acidic or highly alkaline could cause corrosion.}
2) Surface Mount Type (LF-301 series)
Please refer to the following reflow soldering profile and pattern examples for surface mount units.
Reflow Soldering Example
Solder Pattern Example
D: Peak Temperature
250
C: Heat Slope 2
LF-301 A/K series
200
B: Preheat
150
E: 200°C
+ range
100
A: Heat Slope 1
50
0
0
50
100
150
200
250
300
Time (s)
Type
LF-301A/K series
A (Heat Slope 1)
4°C/s max
B (Preheat)
140 to 160°C
(1 min. or less)
C (Heat Slope 2)
4°C/s max.
D (Peak temperature, peak time)
250°C max, 5s max.
E (200°C + range)
50s max.
10-0.6
P=1.27