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BD95371MUV_10 Datasheet, PDF (1/5 Pages) Rohm – Silicon Monolithic Integrated Circuit
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STRUCTURE
TYPE
PRODUCT SERIES
FEATURES
Silicon Monolithic Integrated Circuit
Step down DC/DC converter Controller IC for NOTE PC
BD95371MUV
・Built in H3Reg DC/DC controller
・Switching Frequency Variable (f=200kHz~500kHz)
○ ABSOLUTE MAXIMUM RATINGS(Ta=25℃)
Parameter
Input Voltage 1
Input Voltage 2
Input Voltage 3
BOOT Voltage
BOOT-SW Voltage
HG-SW Voltage
Symbol
VCC
VDD
VIN
BOOT
BOOT-SW
HG-SW
Limit
7 *1*2
7 *1*2
28 *1*2
35 *1*2
7 *1*2
7 *1*2
Unit
V
V
V
V
V
V
LG Voltage
LG
VDD
V
Output Voltage
EN Input Voltage
Power Dissipation 1
Power Dissipation 2
Power Dissipation 3
Power Dissipation 4
VOUT/Is+/Is-
EN
Pd1
Pd2
Pd3
Pd4
VCC
V
7 *1
V
0.34*3
W
0.70*4
W
2.20*5
W
3.56*6
W
Operating Temperature Range
Topr
-10~+100
℃
Storage Temperature Range
Tstg
-55~+150
℃
Maximum Junction Temperature
Tjmax
+150
℃
*1 Not to exceed Pd.
*2 Instantaneous surge voltage, back electromotive force and voltage under less than 10% duty cycle.
*3 Reduced by 2.7mW/℃ for each increase in Ta of 1℃ over 25℃. (when don’t mounted on a heat radiation board )
*4 Reduced by 5.6mW/℃ for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70.0mm×1.6mm 1-layer Glass-epoxy PCB,
copper foil area: 10.29mm2 )
*5 Reduced by 17.6mW/℃ for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70.0mm×1.6mm 4-layer Glass-epoxy PCB,
copper foil area: 10.29mm2 2,3-layer copper foil area: 5505mm2)
*6 Reduced by 28.5mW/℃ for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70.0mm×1.6mm 4-layer Glass-epoxy PCB,
copper foil area: 5505mm2 )
○ OPERATING CONDITIONS(Ta=25℃)
Parameter
Symbol
Input Voltage 1
VCC
Input Voltage 2
VDD
Input Voltage 3
VIN
BOOT Voltage
BOOT
SW Voltage
SW
BOOT-SW Voltage
BOOT-SW
EN Input Voltage
EN
Is Input Voltage
Is+/Is-
MIN ON Time
Tonmin
★ This product is not designed for protection against radioactive rays.
MIN
MAX
Unit
4.5
5.5
V
4.5
5.5
V
4.5
25
V
4.5
30
V
-0.7
25
V
4.5
5.5
V
0
5.5
V
0.7
2.7
V
-
80
ns
REV. A