BD8113EFV Datasheet, PDF (1/5 Pages) Rohm – Silicon Monolithic Integrated Circuit

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Structure
Silicon Monolithic Integrated Circuit
Product series
White LED driver for TFT back light
Type
BD８１１３EFV
Function
・Integrated buck-boost current-mode DC/DC controller
Built-in OSC (external R), External synchronous mode
・Two integrated LED current driver channel ・Built-in under-voltage lock out circuit (UVLO)
（Set by a standard external R current.）
・Built-in over-voltage protection circuit (OVP)
・PWM light modulation
・Built-in thermal shut down circuit (TSD)
・FAIL output（self-diagnosis function）
・Built-in over-current protection circuit (OCP)
・Built-in short detection circuit (SCP)
・Built-in LED open short detection circuit
・Oscillation frequency accuracy ±5%
●Absolute maximum ratings（Ta=25℃）
Parameter
Power supply voltage
BOOT terminal voltage
SW,CS,OUTH terminal voltage
Between BOOT-SW terminal voltage
LED1～2 output voltage
Symbol
VCC
V_BOOT
V_sw,V_CS,V_OUTH
V_BOOT-SW
VLED1～2
Limits
Unit
36
V
41
V
36
V
7
V
36
V
VREG,OVP,OUTL,FAIL1,FAIL2,LEDEN,
ISET,VDAC,PWM,SS,COMP,RT,SYNC,EN
terminal voltage
V_VREG,V_OVP,V_OUTL,V_FAIL1, V_FAIL2,V_LEDEN,
V_ISET,V_VDAC,V_PWM,V_SS,V_COMP,V_RT,V_SYNC,V_EN
-0.3～7 < VCC
V
Power dissipation
Operating temperature range
Storage temperature range
LED maximum output current
Pd
Topr
Tstg
ILED
1.10 ^※1
W
-40～+105
℃
-55～+150
℃
150 ^{※2※3}
mA
※1 IC mounted on glass epoxy board measuring 70mm×70mm×1.6mm, power dissipated at a rate of 8.8mw/℃ at temperatures
above 25℃.
※2 Dispersion figures for LED maximum output current and V_F are correlated. Please refer to data on separate sheet.
※3 Amount of current per channel.
●Operating conditions (Ta=25℃)
Parameter
Symbol
Target value
Unit
Power supply voltage
VCC
5.0～30
V
Oscillation frequency range
ｆOSC
250～600
kHz
External synchronization frequency range ^{※4 ※５}
ｆSYNC
fosc～600
kHz
External synchronization pulse duty range
ｆSDUTY
40～60
%
※4 Connect SYNC to GND or OPEN when not using external frequency synchronization.
※5 Do not switch between internal and external synchronization when an external synchronization signal is input to the device.
REV. E