BD7185AGWL Datasheet, PDF (1/79 Pages) Rohm – Power Management LSI

Datasheet
Power Management LSI
for Mobile Phone
BD7185AGWL
General Description
The BD7185AGWL is an integrated Power Management
LSI available in a small 80-pins 0.4mm-pitch 3.8mm-by-
3.8mm Wafer-level CSP package, which is designed to
meet demands for space-constrained Smart phones.
The device provides 5-Buck Converters.
The device also includes 12 general-purpose LDOs
providing a wide range of voltage and current
capabilities.
All Buck Converters and LDOs are fully controllable by
the I2C interface. The BD7185AGWL is very easy to
use in any mobile platforms.
Features
 5-channel high-efficiency Buck Converters
(16-step adjustable V_O by I²C)
 12-channel CMOS-type LDO
(16-step adjustable V_O by I²C)
 LDO and Buck Converter power ON/OFF control by
I²C interface or external pin.
 Power ON/OFF sequence.
 32.768kHz OSC and output buffer.
 4-to-1 analog switch.
 TCXO buffer.
 SIM card I/F
 I²C compatible Interface.
 I²C device address changeable by ADRS pin.
(Device address is “1001011”,”1001100”)
 Small and thin CSP package
(3.8mm X 3.8mm height 0.57mm max)
Applications
 Smart Phones
 Tablets
 Mobile Router
 Data Transmitter
Key Specifications
 Input Voltage Range:
 Output Voltage Range:
 Switching Frequency:
 OFF Current:
 Operating Temperature Range:
2.6V to 5.5V
1.0V to 3.4V
2.0MHz(Typ)
0.3μA (Typ)
-35℃ to +85℃
Package
UCSP50L3C
W(Typ) x D(Typ) x H(Max)
3.80mm x 3.80mm x 0.57mm
○Product structure：Silicon monolithic integrated circuit
.www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
○This product is not designed protection against radioactive rays
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TSZ02201-0Q4Q0AB00010-1-2
8.Apr.2014 Rev.001