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BD65491FV Datasheet, PDF (1/10 Pages) Rohm – 1-2ch Lens Drivers for SLRs (Single-lens Reflex)
System Lens Drivers for Digital Cameras/SLRs (Single-lens Reflex)
1-2ch Lens Drivers for SLRs
(Single-lens Reflex)
BD65491FV,BD65492MUV
No.11014EAT05
●Description
The BD65491FV motor driver provides 1 Full-ON Drive H-bridge channel, while BD65492MUV provides 2 Full-ON Drive
H-bridge channels. These lens driver series feature wide range operating from 1.8V and low power consumption by high
switching speed in a compact surface mount package.
●Features
1) Low ON-Resistance Power DMOS output:
Full-ON Drive block with 0.35Ω Typ. (BD65491FV)
Full-ON Drive block with0.9Ω Typ. (BD65492MUV)
2) Range of motor power supply voltage: 1.8V to 16.0V
3) Charge pump-less type with p-channel DMOS for the upper side transistor
4) The highest performance in regard to switching speed, and 4-values selection
Turn On Time: 150ns (BD65491FV), 200ns (BD65492MUV)
Turn Off Time: 50ns(BD65491FV), 80ns(BD65492MUV)
5) Drive mode switch function
6) Maximum output current for H-bridge:
DC maximum 1.2A (BD65491FV), 1.0A (BD65492MUV)
Peak maximum 4.0A (BD65491FV)
7) Control input pins corresponding to the signal of 1.8V system
8) Built-in UVLO (Under Voltage Lockout Protection) function and TSD (Thermal Shut Down) circuit
9) Standby current: 0μA Typ.
●Absolute Maximum Ratings
Parameter
Power supply voltage
Symbol
VCC
BD65491FV
-0.5~+7.0
Ratings
BD65492MUV
-0.5~+7.0
Motor power supply voltage
VM
-0.5~+20.0
-0.5~+20.0
Control input voltage
Power dissipation
VIN
-0.5~VCC+0.5
Pd
870*1
-0.5~VCC+0.5
700*2
2200*3
3560*4
Junction temperature
Tjmax
+150
+150
Storage temperature range
Tstg
-55~+150
-55~+150
H-bridge output current (DC)
-1200~+1200*5
H-bridge output current (Peak*6)
Iout
-3200~+3200*6
-1000~+1000*5
H-bridge output current (Peak*7)
-4000~+4000*7
*1 Reduced by 6.96mW/℃ over 25℃, when mounted on a glass epoxy board (70mm  70mm  1.6mm)
*2 Reduced by 5.6mW/℃ over 25℃, when mounted on a glass epoxy 1-layer board (74.2mm  74.2mm  1.6mm).
In surface layer copper foil area: 10.29mm2.
*3 Reduced by 17.6mW/℃ over 25℃, when mounted on a glass epoxy 4-layers board (74.2mm  74.2mm  1.6mm).
In surface & the back layers copper foil area: 10.29mm2, in 2&3-layers copper foil area: 5505mm2.
*4 Reduced by 28.4mW/℃ over 25℃, when mounted on a glass epoxy 4-layers board (74.2mm  74.2mm  1.6mm).
In all 4-layers copper foil area: 5505mm2.
*5 Must not exceed Pd, ASO, or Tjmax of 150℃.
*6 Peak=100msec (Duty≦20%)
*7 Peak=10msec (Duty≦5%)
Unit
V
V
V
mW
mW
mW
℃
℃
mA/ch
mA/ch
mA/ch
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2011.02 - Rev.A