BD6066GU_11 Datasheet, PDF (1/16 Pages) Rohm – White Backlight LED Drivers for Medium to Large LCD Panels (Switching Regulator Type)

LED Drivers for LCD Backlights
White Backlight LED Drivers
for Medium to Large LCD Panels
(Switching Regulator Type)
BD6066GU, BD6066EKN
No.11040EBT26
●Description
BD6066GU/BD6066EKN are white LED driver ICs with PWM step-up DC/DC converter that can boost max 40.5V and
current driver that can drive max 30mA. The wide brightness can be adjusted to control by external PWM pulse on power
control terminal. And, with extended resolution current driver, a few errors between the lines of the current driver, it is suitable
for decreasing the lacking in brightness of the display. BD6066GU, CSP package type, is suited for saving space.
BD6066EKN, HQFN package type, is suited for mounting on the flexible board.
●Features
1) High efficiency PWM step-up DC/DC converter (fsw=1MHz)
2) Extended resolution current driver 4ch
3) Driving^＊12 series × 4parallel =48 white LEDs (^＊white LED Vf=3.2Vmax)
4) Wide input voltage range (2.7V ~ 22V)
5) Rich safety functions
▪ Over-voltage protection (OVP)
▪ Over current limit
▪ External SBD open detect
▪ Thermal shutdown (175 ℃)
6) CSP small & thin package VCSP85H2 2.6 × 2.6 × 0.85mm
HQFN28V 5.2 × 5.2 × 0.95mm
●Applications
Notebook PC, portable DVD player, car navigation systems
● Absolute maximum ratings (Ta=25 ℃)
Parameter
Symbol
Maximum applied voltage 1
VMAX1
Maximum applied voltage 2
VMAX2
Limits
7
15.5
Unit
Condition
V
TEST,ISET,VREG,SENSP,
SENSN, SW, EN1, EN2, PWM
V LED1, LED2, LED3, LED4
Maximum applied voltage 3
VMAX3
30.5
V VBAT
Maximum applied voltage 4
Power dissipation 1 (BD6066GU)
Power dissipation 2 (BD6066EKN)
Power dissipation 3 (BD6066EKN)
Power dissipation 4 (BD6066EKN)
VMAX4
Pd1
Pd2
Pd3
Pd4
50.5
1100 ^*1
560 ^*2
880 ^*3
2650 ^*4
V VDET
mW
mW
mW
mW
Operating temperature range
Topr
-30 ~ +85
℃
Storage temperature range
Tstg
-55 ~ +150
℃
(*1) The measurement value which was mounted on the PCB by ROHM. When it’s used by more than Ta=25 ℃, it’s reduced by 8.8mW/ ℃.
(*2) Reduced 4.5mW/ ℃ With Ta>25 ℃ when not mounted on a heat radiation Board.
(*3) 70mm x 70mm x 1.6mm glass epoxy Board which has 1 layers (60mm x 60mm). When it’s used by more than Ta=25 ℃, it’s reduced by 7.0mW/ ℃.
(*4) 70mm x 70mm x 1.6mm glass epoxy Board which has 2 layers (60mm x 60mm). When it’s used by more than Ta=25 ℃, it’s reduced by 21.2mW/ ℃.
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2011.06 - Rev.B