BD35269HFN Datasheet, PDF (1/16 Pages) Rohm – Silicon Monolithic Integrated Circuit

High Performance Regulators for PCs
Nch FET Ultra LDO
for Desktop PCs
BD35269HFN
No.11030ECT12
●Description
The BD35269HFN ultra low-dropout linear chipset regulator operates from a very low input supply, and offers ideal
performance in low input voltage to low output voltage applications. It incorporates a built-in N-MOSFET power transistor to
minimize the input-to-output voltage differential to the ON resistance (R_{ON MAX}=400mΩ) level. By lowering the dropout
voltage in this way, the regulator realizes high current output (Iomax=1.0A) with reduced conversion loss, and thereby
obviates the switching regulator and its power transistor, choke coil, and rectifier diode. Thus, the 35269HFN designed to
enable significant package profile downsizing and cost reduction. In BD35269HFN, The NRCS (soft start) function enables a
controlled output voltage ramp-up, which can be programmed to whatever power supply sequence is required.
●Features
1) Internal high-precision reference voltage circuit (0.65V±1%)
2) Internal high-precision output voltage circuit
3) Built-in V_CC undervoltage lockout circuit (V_CC=3.80V)
4) NRCS (soft start) function reduces the magnitude of in-rush current
5) Internal Nch MOSFET driver offers low ON resistance (250mΩ typ)
6) Built-in short circuit protection (SCP)
7) Built-in current limit circuit (1.0A min)
8) Built-in thermal shutdown (TSD) circuit
9) Small package HSON8 : 2.9mm×3.0mm×0.6mm
10) Tracking function
●Applications
Notebook computers, Desktop computers, LCD-TV, DVD, Digital appliances
●Absolute maximum ratings (Ta=25℃)
Parameter
Symbol
Ratings
Unit
Input Voltage 1
Input Voltage 2
V_CC
+6.0 *¹
V
V_IN
+6.0 *¹
V
Maximum Output Current
I_O
1*¹
A
Enable Input Voltage
V_EN
-0.3～+6.0
V
Power Dissipation 1
Pd1
0.63 ^*2
W
Power Dissipation 2
Pd2
1.35 ^*3
W
Power Dissipation 3
Pd3
1.75^*4
W
Operating Temperature Range
Topr
-10～+100
℃
Storage Temperature Range
Tstg
-55～+125
℃
Maximum Junction Temperature Tjmax
+150
℃
*1 Should not exceed Pd.
*2 Reduced by 5.04mW/℃ for each increase in Ta≧25℃
(when mounted on a 70mm×70mm×1.6mm glass-epoxy board, 1-layer, copper foil area : less than 0.2%)
*3 Reduced by 10.8mW/℃ for each increase in Ta≧25℃
(when mounted on a 70mm×70mm×1.6mm glass-epoxy board, 1-layer,copper foil area : less than 7.0%)
*4 Reduced by 14.0mW/℃ for each increase in Ta≧25℃
(when mounted on a 70mm×70mm×1.6mm glass-epoxy board, 1-layer,copper foil area : less than 65.0%)
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
1/15
2011.01 - Rev.C