3MC06-050-05_12 Datasheet, PDF (6/8 Pages) RMT Ltd. – Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper

Thermoelectric Cooling Solutions
Thermoelectric Cooler Overview
Cold side Ceramics
(top side)
TE Cooler Lead Free
Internal Assembly
(Lead-Free Solder 230,
Sn-Sb)
Al2O3 Ceramics by default
(AlN solution is available by
request)
Middle Ceramics
Pellets (BiTe posts)
TEC Polarity
(can be modified by
-
request)
+
Terminal Wires
Hot Side Ceramics
(bottom side)
Application Tips
1. Never heat TE module more than 200˚C (TEC
assembled at 230˚C).
2. Never use TE module without an attached heat sink
at hot (bottom) side.
1. Connect TE module to DC power supply according
to polarity.
2. Do not apply DC current higher than Imax.
Installation
1. Mechanical Mounting. TEC is placed between two heat exchangers . This construction is fixed by screws or in
another mechanical way. It is suitable for large modules (with dimensions 30x30mm and larger). Miniature types
require other assembling methods in most cases.
1. Soldering. This method is suitable for a TE module with metallized outside surfaces. RMT provides this option
and also makes pre-tinning for TE modules.
2. Glueing. It is an up-to-date method that is used by many customers due to availability of glues with good
thermoconductive properties. A glue is usually based on some epoxy compound filled with some
thermoconductive material such as graphite or diamond powders, silver, SiN and others. The application of a
specific type depends on application features and the type of a TE module.
Object being cooled
Object being cooled
1
Screw mounting
TEC
2
Heatsink
Soldering
TEC
3
Heatsink
Gluing
46 Warshavskoe shosse. Moscow 115230 Russia, ph: [phone], fax: [phone], web: www.rmtltd.ru
Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
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