1MC04-103-05 Datasheet, PDF (1/8 Pages) RMT Ltd. – Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper

Thermoelectric Cooling Solutions
Performance Parameters
Type
ΔTmax Qmax Imax Umax AC R H
K
W
A
V Ohm mm
1MC04-103-xx (N=103)
1MC04-103-05
71 11.38 1.5
1MC04-103-08
72
7.35 0.9
1MC04-103-10
73
5.95 0.8
1MC04-103-12
73
5.01 0.6
1MC04-103-15
73
4.02 0.5
Performance data are given for 300K, vacuum
6.51 1.6
10.32 1.9
12.9 12.86 2.1
15.39 2.3
19.20 2.6
Dimensions
1MC04-103-XX
Manufacturing options
A. TEC Assembly:
* 1. Solder SnSb (Tmelt=230°C)
2. Solder AuSn (Tmelt=280°C)
B. Ceramics:
* 1.Pure Al2O3(100%)
2.Alumina (Al2O3- 96%)
3.Aluminum Nitride (AlN)
* - used by default
C. Ceramics Surface Options:
1. Blank ceramics (not metallized)
2. Metallized (Au plating)
3. Metallized and pre-tinned with:
3.1 Solder 117 (In-Sn, Tmelt =117°C)
3.2 Solder 138 (Sn-Bi, Tmelt = 138°C)
3.3 Solder 143 (In-Ag, Tmelt = 143°C)
3.4 Solder 157 (In, Tmelt = 157°C)
3.5 Solder 183 (Pb-Sn, Tmelt =183°C)
3.6 Optional (specified by Customer)
D. Thermistor (optional)
Can be mounted to cold side
ceramics edge. Calibration is
available by request.
E. Terminal contacts
1. Blank, tinned Copper
2. Insulated Wires
3. Insulated, color coded
46 Warshavskoe shosse. Moscow 115230 Russia, ph: [phone], fax: [phone], web: www.rmtltd.ru
Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
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