R1154 Datasheet, PDF (7/22 Pages) RICOH electronics devices division – 150mA Voltage Regulator (Wide Input Voltage Range)

R1154x
POWER DISSIPATION (SOT-89-5)
This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board.
This specification is based on the measurement at the condition below:
Measurement Conditions
High Wattage Land Pattern
Environment
Mounting on Board (Wind velocity=0m/s)
Board Material Glass cloth epoxy plastic (Double sided)
Board
Dimensions
Copper Ratio
30mm  30mm  1.6mm
Top side : Approx. 20% ,
Back side : Approx. 100%
Through-holes
0.85mm  10pcs
Standard Land Pattern
Mounting on Board (Wind velocity=0m/s)
Glass cloth epoxy plastic (Double sided)
50mm  50mm  1.6mm
Top side : Approx. 10% ,
Back side : Approx. 100%

Measurement Results
Power Dissipation
Thermal Resistance
High Wattage Land Pattern
1300mW
77C/W
Standard Land Pattern
900mW
111C/W
(Topt=25C,Tjmax=125C)
Free Air
500mW
200C/W
1600
1400 ₁₃₀₀
On Board
(High Wattage Land Pattern)
30
7.5
15
50
1200
1000
800 ⁹⁰⁰
On Board
(Standard Land Pattern)
600
400 ⁵⁰⁰
200
Free Air
0
0
25
50
75
100105 125 150
Ambient Temperature (C)
Power Dissipation
High Wattage
Standard
Measurement Board Pattern
IC Mount Area (Unit: mm)
RECOMMENDED LAND PATTERN
0.7 Max. 1.0 0.7 Max.
45°
2.0
1.5 1.5
(Unit: mm)
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