R1511 Datasheet, PDF (6/20 Pages) RICOH electronics devices division – Input Voltage Range 3.5V to 36V

R1511x
Power Dissipation (TO-252-5-P2)
This specification is at mounted on board. Power Dissipation (P_D) depends on conditions of mounting on board.
This specification is based on the measurement at the condition below:
Measurement conditions
Standard Land Pattern
Environment
Mounting on board (Wind velocity 0m/s)
Board Material
Glass cloth epoxy plastic
(Double-layers)
Board Dimensions
50mm * 50mm * 1.6mm
Copper Ratio
Top side: Approx. 50%,
Back side: Approx. 50%
Through - hole
φ 0.5mm * 24pcs
High Wattage Land Pattern
Mounting on board (Wind velocity 0m/s)
Glass cloth epoxy plastic
(Four-layers)
76.2mm * 114.3mm * 0.8mm
Top, Back side: Approx. 96%,
2nd, 3rd: 100%
φ 0.4mm * 30pcs
Measurement Results
Power Dissipation
Thermal Resistance
Standard Land Pattern
1900mW
θja=(125-25°C)/1.9W= 53°C/W
θjc= 17°C/W
(Ta=25°C)
High Wattage Land Pattern
3800mW
θja= (125-25°C)/3.8W = 26°C/W
θjc= 7°C/W
5000
On Board
3800
(High W attage Land Pattern)
50
4000
76.2
50
3000
2000 ¹⁹⁰⁰
On Board
(Standard Land Pattern)
1000
0
105
0
25
50
75 100 125 150
Ta (°C)
Power Dissipation
Standard
IC Mount Area Unit: mm
High Wattage
IC Mount Area Unit: mm
6