R1212D Datasheet, PDF (40/41 Pages) RICOH electronics devices division – STEP-UP DC/DC CONTOLLER

PACKAGE INFORMATION
PE-SON-8-0510
POWER DISSIPATION (SON-8)
This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board.
This specification is based on the measurement at the condition below:
Measurement Conditions
Environment
Board Material
Board Dimensions
Copper Ratio
Through-hole
Standard Land Pattern
Mounting on Board (Wind velocity=0m/s)
Glass cloth epoxy plactic (Double sided)
40mm × 40mm × 1.6mm
Top side : Approx. 50% , Back side : Approx. 50%
φ0.5mm × 44pcs
Measurement Result
Power Dissipation
Thermal Resistance
Standard Land Pattern
480mW
θja=(125−25°C)/0.48W=208°C/W
(Topt=25°C,Tjmax=125°C)
Free Air
300mW
333°C/W
600
500 ⁴⁸⁰
On Board
400
Free Air
300
200
100
0
0
25
50
75 85 100 125 150
Ambient Temperature (°C)
Power Dissipation
RECOMMENDED LAND PATTERN
0.35 0.65
40
Measurement Board Pattern
IC Mount Area (Unit : mm)
(Unit: mm)