R1163N151B Datasheet, PDF (33/36 Pages) RICOH electronics devices division – 3-MODE 150mA LDO REGULATOR with the Reverse Current Protection

PACKAGE INFORMATION
PE-PLP1616-6-0606
POWER DISSIPATION (PLP1616-6)
This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board.
This specification is based on the measurement at the condition below:
(PLP1616-6 is a reference value calculated from the PLP1820-6 package.)
Measurement Conditions
Environment
Board Material
Board Dimensions
Copper Ratio
Through-hole
Standard Land Pattern
Mounting on Board (Wind velocity=0m/s)
Glass cloth epoxy plactic (Double sided)
40mm × 40mm × 1.6mm
Top side : Approx. 50% , Back side : Approx. 50%
φ0.54mm × 30pcs
Measurement Result
Power Dissipation
Thermal Resistance
(Topt=25°C,Tjmax=125°C)
Standard Land Pattern
560mW
θja=(125−25°C)/0.56W=179°C/W
600
560
40
500
On Board
400
300
200
100
0
0
25
50
75 85 100 125 150
Ambient Temperature (°C)
Power Dissipation
Measurement Board Pattern
IC Mount Area Unit : mm
RECOMMENDED LAND PATTERN
0.50
0.25
0.90
0.125
0.225
0.35
(Unit: mm)