R1171S151A Datasheet, PDF (32/36 Pages) RICOH electronics devices division – 2.0A/1.5A LDO REGULATOR

PACKAGES INFORMATION
PE-HSOP-6J-0701
POWER DISSIPATION (HSOP-6J)
This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board.
This specification is based on the measurement at the condition below:
Measurement Conditions
High Wattage Land Pattern
Environment
Mounting on Board (Wind velocity=0m/s)
Board Material
Glass cloth epoxy plactic (Double sided)
Board Dimensions
50mm × 50mm × 1.6mm
Copper Ratio
90%
Through-hole
φ0.5mm × 44pcs
Standard Land Pattern
Mounting on Board (Wind velocity=0m/s)
Glass cloth epoxy plactic (Double sided)
50mm × 50mm × 1.6mm
50%
φ0.5mm × 44pcs
Measurement Result
Power Dissipation
Thermal Resistance
High Wattage Land Pattern
2000mW
50°C/W
Standard Land Pattern
1700mW
59°C/W
(Topt=25°C,Tjmax=125°C)
Free Air
540mW
185°C/W
2600
2400
2200
On Boad (High Wattage Land Pattern)
2000
1800 1700
1600
On Boad (Standerd Land Pattern)
1400
1200
1000
Free Air
800
600 ⁵⁴⁰
400
200
0
0 25 50 75 85 100 125 150
Ambient Temperature (°C)
Power Dissipation
50
50
18
20
High Wattage
Standard
Measurement Board Pattern
IC Mount Area Unit : mm
RECOMMENDED LAND PATTERN (HSOP-6J)
1.905 1.905
0.6
1.87
(Unit: mm)