RP101X Datasheet, PDF (26/31 Pages) RICOH electronics devices division – LOW NOISE 300mA LDO REGULATOR

PACKAGE INFORMATION
PE-PLP1612-4-0610
POWER DISSIPATION (PLP1612-4)
This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board.
This specification is based on the measurement at the condition below:
Measurement Conditions
Environment
Board Material
Board Dimensions
Copper Ratio
Through-hole
Standard Land Pattern
Mounting on Board (Wind velocity=0m/s)
Glass cloth epoxy plactic (Double sided)
40mm × 40mm × 1.6mm
Top side : Approx. 50% , Back side : Approx. 50%
φ0.54mm × 24pcs
Measurement Result
Power Dissipation
Thermal Resistance
(Topt=25°C,Tjmax=125°C)
Standard Land Pattern
610mW
θja=(125−25°C)/0.61W=164°C/W
700
610
600
500
On Board
400
300
200
100
0
0
25
50
75 85 100 125 150
Ambient Temperature (°C)
Power Dissipation
40
Measurement Board Pattern
IC Mount Area Unit : mm
RECOMMENDED LAND PATTERN
0.6
0.35
1.0
(Unit: mm)