R1131D081A Datasheet, PDF (25/30 Pages) RICOH electronics devices division – Low Voltage 300mA LDO REGULATOR

PACKAGE INFORMATION
PE-HSON-6-0611
POWER DISSIPATION (HSON-6)
This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board.
This specification is based on the measurement at the condition below:
Measurement Conditions
Environment
Board Material
Board Dimensions
Copper Ratio
Through-hole
Standard Land Pattern
Mounting on Board (Wind velocity=0m/s)
Glass cloth epoxy plactic (Double sided)
40mm × 40mm × 1.6mm
Top side : Approx. 50% , Back side : Approx. 50%
φ0.5mm × 44pcs
Measurement Result
Power Dissipation
Thermal Resistance
Standard Land Pattern
900mW
θja=(125−25°C)/0.9W=111°C/W
(Topt=25°C,Tjmax=125°C)
Free Air
400mW
250°C/W
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
0
On Board
Free Air
25
50
75 85 100 125 150
Ambient Temperature (°C)
Power Dissipation
RECOMMENDED LAND PATTERN
0.35
0.95
1.6
40
Measurement Board Pattern
IC Mount Area Unit : mm
(Unit: mm)