RP102K121B_17 Datasheet, PDF (22/30 Pages) RICOH electronics devices division – LOW NOISE 300mA LDO REGULATOR

RP102x
NO.EA-141-160705
PACKAGE INFORMATION
Power Dissipation (WLCSP-4-P2)
This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board.
This specification is based on the measurement at the condition below:
Measurement Conditions
Environment
Board Material
Board Dimensions
Copper Ratio
Through-hole
Standard Land Pattern
Mounting on Board (Wind velocity=0m/s)
Glass cloth epoxy plastic (Double-sided)
40mm x 40mm x 1.6mm
Top side: Approx. 50%, Back side: Approx. 50%
0.5mm x pcs
Measurement Result
Power Dissipation
Thermal Resistance
800
662
600
530
400
Standard Land Pattern
530mW (Tjmax=125C)
662mW (Tjmax=150C)
ja(125-25C)/0.53W189C/W
(Ta=25C)
40
200
0
0
25
50
75 ⁸⁵ 100 125 150
Ambient Temperature (ºC)
Power Dissipation
Measurement Board Pattern
IC Mount Area (Unit: mm)
The above graph shows the Power Dissipation of the package based on Tjmax=125C and Tjmax=150C.
Operating the IC in the shaded area in the graph might have an influence on its lifetime.
Operating time must be within the time limit described in the table below, in case of operating in the shaded area.
Operating Time
13,000 hours
Estimated years
(Operating 4 hours/day)
9years
22