R1180N121B Datasheet, PDF (19/24 Pages) RICOH electronics devices division – 150mA LDO REGULATOR

PACKAGE INFORMATION
PE-SC-82AB-0512
POWER DISSIPATION (SC-82AB)
This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board.
This specification is based on the measurement at the condition below:
Measurement Conditions
Environment
Board Material
Board Dimensions
Copper Ratio
Through-hole
Standard Land Pattern
Mounting on Board (Wind velocity=0m/s)
Glass cloth epoxy plactic (Double sided)
40mm × 40mm × 1.6mm
Top side : Approx. 50% , Back side : Approx. 50%
φ0.5mm × 44pcs
Measurement Result
Power Dissipation
Thermal Resistance
Standard Land Pattern
380mW
θja=(125−25°C)/0.38W=263°C/W
(Topt=25°C,Tjmax=125°C)
Free Air
150mW
667°C/W
600
500
40
On Board
400 ³⁸⁰
300
200 ₁₅₀
100
Free Air
0
0
25
50
75 85 100 125 150
Ambient Temperature (°C)
Power Dissipation
Measurement Board Pattern
IC Mount Area (Unit : mm)
RECOMMENDED LAND PATTERN
0.65 0.65
0.6
0.6
0.6
0.8
0.65 0.6
(Unit: mm)