RP112 Datasheet, PDF (11/32 Pages) –

• Power Dissipation (SC-88A)
RP112x
NO.EA-258-131024
Power Dissipation (P_D) depends on conditions of mounting on board. This specification is based on the
measurement at the conditions below:
Measurement Conditions:
Environment
Board Material
Board Dimensions
Copper Ratio
Through-hole
Standard Test Land Pattern
Mounting on Board (Wind velocity=0m/s)
Glass cloth epoxy plastic (Double Layers)
40mm × 40mm × 1.6mm
Top side: Approx. 50%, Back side: Approx. 50%
φ 0.5mm x 44pcs
Measurement Result:
Power Dissipation
Thermal Resistance
Standard Test Land Pattern
380mW (Tjmax=125°C)
475mW (Tjmax=150°C)
θja=(125-25°C)/0.38W=263°C/W
θjc=75°C/W
Free Air
(Ta=25°C)
150mW
θja=(125-25°C)/0.15W=667°C/W
-
600
475
500
Standard Test Land Pattern
400
380
300
Free Air
200 150
100
0
0
25 50 75 85 100 125 150
Ambient Temperature (ºC)
Power Dissipation
40
Measurement Board Pattern
IC Mount Area (Unit: mm)
The above graph shows that the power dissipation of the package under the conditions of
Tjmax=125°C and Tjmax=150°C. The use under the diagonal line in the graph might have an affect
on the ICs’ lifetime. Please use the ICs within the limited operating time and estimated years as
described below.
Operating Time
13,000 hours
Estimated Years (4hrs/day)
9 years
11