RT6212C Datasheet, PDF (15/16 Pages) Richtek Technology Corporation – Step-Down Converter

2.0
Four-Layer PCB
1.5
1.0
0.5
0.0
0
25
50
75
100
125
Ambient Temperature (°C)
Figure 7. Derating Curve of Maximum Power
Dissipation
RT6212C/D
Layout Considerations
 Follow the PCB layout guidelines for optimal
performance of the device.
 Keep the traces of the main current paths as short
and wide as possible.
 Put the input capacitor as close as possible to VIN
and VIN pins.
 LX node is with high frequency voltage swing and
should be kept at small area. Keep analog
components away from the LX node to prevent stray
capacitive noise pickup.
 Connect feedback network behind the output
capacitors. Keep the loop area small. Place the
feedback components near the device.
 Connect all analog grounds to common node and
then connect the common node to the power ground
behind the output capacitors.
 For better thermal performance, to design a wide
and thick plane for GND pin or to add a lot of vias to
GND plane.
 An example of PCB layout guide is shown in Figure
8 for reference.
Place the feedback as close
to the IC as possible.
V_OUT
R1
R2
BOOT EN FB
The only GND pin
6
5
4
must be connected
to a wide and thick
2
3
plane for thermal
consideration.
GND LX VIN
C_BOOT
LX should be connected
L
GND
C_IN
to inductor by wide and
short trace, and keep
sensitive components
away from this trace.
V_OUT
C_OUT
Place the input and output capacitors
as close to the IC as possible.
Figure 8. PCB Layout Guide
Copyright © 2017 Richtek Technology Corporation. All rights reserved.
DS6212C/D-00 April 2017
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
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