SDA-5000 Datasheet, PDF (7/7 Pages) JDS Uniphase Corporation – Stealth Digital Analyzer

SDA-5000
Assembly Diagram
Measurement Technique
All specifications and typical performances reported in this document were measured in the following manner. Data was taken
using a temperature controlled probe station utilizing 150μm pitch GSG probes. The interface between the probes and integrated
circuit was made with a coplanar to microstrip ceramic test interface. The test interface was then wire bonded to the die as shown
in the figure below using 1 mil diameter bondwires. The spacing between the test interface and the die was 200μm, and the bond
wire loop height was 100μm. The thickness of the test interface is 125μm (5mil). The calibration of the test fixture included the
probes and test interfaces, so that the measurement reference plane was at the point of bond wire attachment. Therefore, all data
represents the integrated circuit and accompanying bond wires.
RF Micro Devices Inc. 7628 Thorndike Road, Greensboro, NC 27409-9421
DS140210
For sales or technical support, contact RFMD at +1.336.678.5570 or [e-mail].
The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of
third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended
application circuitry and specifications at any time without prior notice.
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