RF5198_1 Datasheet, PDF (7/8 Pages) RF Micro Devices – 3V 1950MHZ W-CDMA LINEAR POWER AMPLIFIER MODULE

RF5198
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3μinch
to 8μinch gold over 180μinch nickel.
PCB Land Pattern Recommendation
PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested
for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly pro-
cesses. The PCB land pattern has been developed to accommodate lead and package tolerances.
PCB Metal Land Pattern
A = 0.64 x 0.28 (mm) Typ.
B = 0.28 x 0.64 (mm) Typ.
C = 0.78 x 0.64 (mm)
D = 0.64 x 1.28 (mm)
E = 1.50 (mm) Sq.
0.75
Typ.
Pin 16
B
Pin 1
0.50
A
Typ. _A
A
0.55
Typ.
A
B
0.55
Typ.
1.50
Typ.
CB
E
BBB
0.75
Typ.
Dimensions in mm.
D
0.75
Typ.
A
1.00
Typ.
Pin 8
Figure 1. PCB Metal Land Pattern (Top View)
Rev A5 DS060310
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at ([phone] or [e-mail].
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