RF5632 Datasheet, PDF (6/18 Pages) RF Micro Devices – SINGLE 5.0V, 2.3 TO 2.7 GHZ LINEAR POWER AMPLIFIER

RF5632
4.000± 0.1
0.203±0.050
0.030
Package Drawing
0.287±0.05
2.700±0.100
19 20 21 22 23 24
18
17
4.000± 0.1
16
15
14
0.500 BSC
13
#1
2
3
2.700±0.100
4
5
6
0.350±0.050
12 11 10
9
8
7
0.230±0.050
0.850±0.05
10x
0.270
10x 0.270
12x 0.300
12x 0.300
6x 1.793
10x
0.120
2x 1.250
2x 0.750
2x 0.250
0.000
2x 0.250
10x 0.120
12x 0.150
2x 0.750
2x 1.250
6x 1.793
12x 0.150
10x
0.270
6x 1.793
2x 1.250
2x 0.750
2x 0.250
0.000
2x 0.250
10x 0.293
2x 0.325
12x 0.377
2x 0.325
2x 0.750
2x 1.250
6x 1.793
12x 0.377
6x 1.793
2x 1.250
2x 0.750
2x 0.725
2x 0.250
0.000
2x 0.250
2x 0.725
2x 0.750
2x 1.250
6x 1.793
PCB METAL LAND PATTERN
PCB SOLDER MASK PATTERN
PCB STENCIL PATTERN
Thermal vias for center slug “C” should be incorporated into the PCB design. The number and size of thermal
vias will depend on the application, the power dissipation, and the electrical requirements. Example of the num-
ber and size of vias can be found on the RFMD evaluation board layout.
6 of 18
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DS120213